EP21TCHT-1 EPOXY
Master Bond
Published at : 29 Nov 2021
Master Bond Polymer System EP21TCHT-1 is a two component epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures.
EP21TCHT-1 has high thermal conductivity and superior electrical insulation properties. It has a service operating temperature range of 4K to 400°F. It also has a remarkably low thermal expansion coefficient. EP21TCHT-1 is NASA qualified for low outgassing applications. It is highly recommended for use in vacuum environments.
thermally conductiveroom temperature curinghigh thermal conductivity